Masking Tape / red high temperature masking tape / common masking tape / medium temperature masking tape 
 Masking tape (for electronic components Tape) features: a very good viscosity, good heat resistance, good tensile strength, retention, and no residue, can be several times under high temperature baking. 
 Use: widely used in electronic components such as: ceramic capacitors, polyester capacitors, metallized capacitors, thermistors and other products of the manufacturing process tape. You may be different based on the temperature requirements to select different types of tape. Width of the length of the different needs based on your selection. 



 Double-sided tape of polyimide / polyimide (Flow Festival) film / polyimide tape 
 Structure: 
 Double-sided polyimide tape with polyester film as substrate, coated with high temperature silicone adhesive imported from. 
 Performance: 
 Tape has excellent heat resistance, electrical insulation, chemical resistance, high adhesion, softness and then tear away from the docile and no residue and other characteristics. For electroplating, ultra-high temperature paint and powder coating industries. 
 Main Specifications: 
 Color Green / Transparent 
 Polyester film substrate 
 Thickness (mm) 0.06/0.08 
 From the film (mm) 0.075 
 Adhesion (N/25mm) 6.2 
 Tensile strength (kg/25mm) 124/155 
 Elongation (%) 120 
 Temperature Resistance (℃) 200 ℃ 30 minutes without residue 
 Storage environment 25 ℃, 65% RH 
 Specifications: 
 Length (m) 33 ~ 500 
 Width (mm) 0-500mm, per customer specifications specified 


 HF, FHF polyimide - F -16 composite films 
 Structure: 
 Produced by HF, FHF is polyimide (stream Festival) F-46 film emulsion dipping, high temperature sintering. 
 Performance: 
 Polyimide has excellent electrical insulation properties and temperature resistance, corrosion resistance, radiation and other characteristics, also has high-temperature melting sticky self-sealing characteristics. 
 Main Specifications: 
 No Specification 
 Unit value index 
 Thickness tolerance of 1% ≥ 10 
 2, the longitudinal tensile strength Mpa ≥ 110 
 Horizontal ≥ 100 
 3, the longitudinal elongation at break% ≥ 40 
 Horizontal ≥ 30 
 4 breakdown strength 50HZ, 20 ± 5 ℃ KV / mm minimum average 
 ≥ 120 ≥ 80 
 5, F and F surface peel strength N/25mm ≥ 6 
 Specifications and requirements: 
 Type F compound layer thickness the entire diameter of the entire disk drive on the streets 
 HF 0.04-0.06 0.006-0.009 2-3 ??months pcs = 230 
 FHF 0.045-0.07 0.006-0.009 2-3 ??months pcs = 230 
 Uses: 
 Widely used in wire and cable, magnet wire insulation, and various H-class motor and electrical insulation 
 Note: The above figures chosen by the Company in accordance with accepted test methods of data obtained after repeated testing average. If customers have special requirements, please contact the company, we will provide you with further services.